Electronic paste: The precise “blood” of modern electronic devices
Electronic paste, as the core material of microelectronics manufacturing, is a precision composite material composed of metal powder, glass frits, and organic carrier, which forms functional structures through printing, drying, firing, and other processes.
According to functional differences, it is mainly divided into four categories: dielectric paste, conductor paste, resistance paste, and encapsulation paste, which together construct the micro structure of modern electronic devices.
Typical Applications of Electronic Paste
This paste facilitates electrical conductivity and is commonly used for printed circuits, electrodes, and interconnects. It typically contains silver, copper, or carbon-based materials to ensure low resistance and high durability. It ensures superior electrical conductivity, corrosion resistance, and strong adhesion to surfaces.
The resistor paste is used to create resistive elements in circuits, resistor paste provides precise resistance values and stability. It is widely employed in thick-film resistor networks and hybrid integrated circuits. It offers customizable resistance values, high precision, and excellent thermal stability.
The paste is used as an insulating material, dielectric paste provides electrical insulation between conductive layers while maintaining high thermal stability. It is crucial in multilayer ceramic capacitors (MLCCs) and other electronic components that require robust insulation properties.
Overcoat Protective Paste
The paste is designed to protect electronic components from environmental damage, encapsulation paste offers mechanical strength, thermal resistance, and moisture protection. It is frequently applied in semiconductor packaging and sensor protection. It delivers strong protection against moisture, chemicals, and mechanical stress, improving device lifespan.
Medium Temperature Firing Overcoat Paste
High temperature Firing Overcoat Paste
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