Thermal Pads

Thermally conductive silicon/ non-silicon pads (thermal pads) are widely used in PC cooling applications, including laptop heat dissipation systems, as well as for cooling critical components such as GPUs, CPUs, SSDs, VRAM, LEDs, and power chips. These pads offer excellent thermal conductivity for efficient heat transfer, combined with electrical insulation, outstanding vibration damping, and superior shock absorption. Their soft, compliant nature ensures close contact between heat sources and heat sinks, compensating for uneven surfaces while providing reliable long-term performance.

Thermal Conductive Gap Filler

Custom processing: Yes
Specifications: Can be customized
Color: Can be customized
Product material : Silicone
Product shape: On-demand die cutting
Thermal conductivity: 1.0-16.0 W/m·K

Test Items	Test Method	Unit	GTP-070IM	GTP-080	GTP-090	GTP-120	GTP-140	GTP-160
Color	Visual Inspection	–	Multicolor	Multicolor	Gray	Gray	Gray	Gray
Thickness	ASTMD374	mm	0.5~10.0	0.5~10.0	0.5~10.0	0.5~5.0	0.5~5.0	0.5~5.0
Hardness	ASTMD2240	Shore 00	25~70	40~70	40~70	50~70	50~70	55~70
Density	ASTMD792	g/cm³	3.49	3.21	3.17	2.81	2.78	2.75
Tensile Strength	ASTMD412	Psi	32	32	32	32	32	32
Breakdown Voltage	ASTMD149	KV/mm	≥8.0	≥8.0	≥8.0	≥8.0	≥8.0	≥8.0
Volume Resistivity	ASTMD257	Ohm·cm	8.742×10¹²	6.87×10¹²	8.601×10¹²	3.534×10¹²	3.534×10¹²	3.534×10¹²
Temperature Range	EN344	℃	-40~+200	-40~+200	-40~+200	-40~+180	-40~+180	-40~+180
Standard Sheet Size	–	mm	300×400	300×400	300×400	300×300	200×400	200×400
Fireproof Performance	UL94	–	V-0	V-0	V-0	V-0	V-0	V-0
Dielectric Constant	ASTMD150	@lMHZ	7.47	4.15	5.63	4.78	4.78	4.78
Thermal Conductivity	ASTMD5470	W/m·K	7.0	8.0	9.0	12.0	14.0	16.0

Test Items	Test Method	Unit	GTP-010	GTP-020	GTP-030	GTP-040	GTP-050	GTP-060IM
Color	Visual Inspection	–	Multicolor	Multicolor	Multicolor	Multicolor	Multicolor	Multicolor
Thickness	ASTMD374	mm	0.1~10.0	0.15~10.0	0.2~10.0	0.3~10.0	0.25~10.0	0.5~10.0
Hardness	ASTMD2240	Shore 00	5~60	20~60	15~60	25~70	25~80	25~70
Density	ASTMD792	g/cm³	1.76	2.72	2.88	3.03	3.15	3.59
Tensile Strength	ASTMD412	Psi	25	28	32	32	25	32
Breakdown Voltage	ASTMD149	KV/mm	≥10.0	≥10.0	≥10.0	≥10.0	≥10.0	≥8.0
Volume Resistivity	ASTMD257	Ohm·cm	3.749×10¹²	7.19×10¹²	8.58×10¹²	5.096×10¹²	4.39×10¹²	3.293×10¹²
Temperature Range	EN344	℃	-40~+200	-40~+200	-40~+200	-40~+200	-40~+200	-40~+200
Standard Sheet Size	–	mm	300×400	300×400	300×400	300×400	300×400	300×400
Fireproof Performance	UL94	–	V-0	V-0	V-0	V-0	V-0	V-0
Dielectric Constant	ASTMD150	@lMHZ	3.56	3.10	3.40	4.54	4.82	4.32
Thermal Conductivity	ASTMD5470	W/m·K	1.0	2.0	3.0	4.0	5.0	6.0

Non-Silicon Thermal Pad

Custom processing: Yes
Specifications: Can be customized
Color: Can be customized
Product material: Non-silicone
Thermal conductivity: 1.0-7.0 W/m·K

Test Items	Test Method	Unit	GTP-SF-010	GTP-SF-020	GTP-SF-030	GTP-SF-050	GTP-SF-060	GTP-SF-070
Color	Visual Inspection	–	Multicolor	Multicolor	Multicolor	Multicolor	Gray	Gray
Thickness	ASTMD374	mm	0.5~5.0	0.5~5.0	0.5~5.0	0.5~5.0	0.5~5.0	0.5~3.0
Hardness	ASTMD2240	Shore 00	30~45	30~60	30~60	50~60	50~60	50~60
Density	ASTMD792	g/cm³	2.0	2.3	2.98	3.3	3.35	2.8
Tensile Strength	ASTMD412	Psi	32	32	32	32	32	40
Breakdown Voltage	ASTMD149	KV/mm	≥10.0	≥10.0	≥10.0	≥8.0	≥8.0	≥8.0
Volume Resistivity	ASTMD257	Ohm·cm	3.749×10¹²	7.19×10¹²	8.58×10¹²	4.39×10¹²	3.293×10¹²	8.742×10¹²
Temperature Range	EN344	℃	-40~+125	-40~+125	-40~+125	-40~+125	-40~+125	-40~+125
Standard Sheet Size	–	mm	200×400	200×400	200×400	200×400	200×400	200×400
Fireproof Performance	UL94	–	V-0	V-0	V-0	V-0	V-0	V-0
Dielectric Constant	ASTMD150	@lMHZ	3.56	3.10	3.40	4.82	4.32	7.47
Thermal Conductivity	ASTMD5470	W/m·K	1.0	2.0	3.0	5.0	6.0	7.0

Thermal Pads

Thermal Conductive Gap Filler

Non-Silicon Thermal Pad

Enabling Leading Electronic Connectivity