Conductor Paste
Conductor pastes are specialized materials used to create electrical connections between substrates in electronic components. These pastes are typically composed of metal particles suspended in a binder or carrier fluid, which allows for easy application to various surfaces.
The most common types of conductor pastes include silver conductive paste, palladium-silver conductive paste, gold paste, carbon paste, etc. Each has distinct compositions, applications, and industrial uses.
The conductor paste we offer are mainly for the applications in industries such as telecommunications, electronics, automobile, multimedia and medical device.
| Substrate | Curing & Firing Condition | Conductivity | Features & Applications | |
|---|---|---|---|---|
| CP1201 | Flexible substrate(PET, PU,PC, PCB) | 130℃/30min | < 10mΩ/sq/mil | Membrane Switches Keypads, Flexible circuits,RFID |
| CP1203 | Tantalum capacitor | 160℃/20min | < 2*10-5Ω.cm | Tantalum capacitor electrodes |
| CP1501 | Most flexible substrates, such as PET/PI/PC/PMMA, etc | 130℃/30min | <200mΩ/sq/mil | Membrane switches, electric heating film, RFID antenna, electromagnetic shielding |
| CP1503 | Most flexible substrates, such as PET/PI/PC/PMMA, etc | 130℃/30min | < 35mΩ/sq/mil | Membrane switches, electric heating film, RFID antenna, electromagnetic shielding |
| CP1504 | Most flexible substrates, such as PET/PI/PC/PMMA, etc | 150℃/30min | < 35mΩ/sq/mil | Membrane switches, electric heating film, RFID antenna, electromagnetic shielding |
| CP1507 | Most flexible substrates, such as PET/PI/PC/PMMA, etc | 135℃/30min | < 30mΩ/sq/mil | Membrane switches, electric heating film, RFID antenna, electromagnetic shielding |
| CP1510 | Most flexible substrates, such as PET/PI/PC/PMMA, etc | 90℃/20min | < 10mΩ/sq/mil | Membrane switches, electric heating film, RFID antenna, electromagnetic shielding |
| CP8206S | Most flexible substrates, such as PET/PI, etc | 90℃/8min | < 30mΩ/sq/mil | Medical test strips |
| CP8207 | Most flexible substrates, such as PET/PI, etc | 90℃/8min | ≤ 18mΩ/sq/mil | Medical test strips |
| CP8201 | Most flexible substrates, such as PET/PI, etc | 150℃/4min | < 13mΩ/sq/mil | Low temperature quick drying, suitable for large and small membrane keyboards |
| CP8206 | Most flexible substrates, such as PET/PI, etc | 150℃/4min | < 30mΩ/sq/mil | Low temperature quick drying, suitable for large and small membrane keyboards |
| CP1506-3 | PET/PI, TPU | 120℃/30min | 2~3*10-3Ω.cm | TPU stretchable paste, suitable for automotive cockpit flexible circuits |
| CP1506 | PET/PI, TPU | 120℃/30min | ≤ 18mΩ/sq/mil | TPU stretchable paste, suitable for automotive cockpit flexible circuits |
| CP550x | Various ceramic, quartz glass | 550-650℃/10-12min | ≤ 3~5mΩ/sq | Chip component, consumed Hybrid Integrated thick film circuit, heating element, household appliances |
| CP5801 | Alumina ceramic | 620℃/7~10min | < 3mΩ/sq/mil | Thermal printing chips, ceramic sensors, atomizer chips, transducer chips, buzzer chips, etc |
| CP600x | Glass | 600℃~650℃/3min | ≤ 3~7.5mΩ/sq | Automotive glass, architectural glass, etc |
| CP680x | Glass | 680℃~710℃/3min | ≤ 4~12mΩ/sq | Automotive glass, architectural glass, etc |
| CP6502 | Microcrystalline glass, automotive glass, ITO glass, ultra white glass | 500℃/7~10min | < 3mΩ/sq/mil | Conductive circuits such as microcrystalline glass, automotive glass, ITO glass, and ultra white glass |
| CP7001 | Microcrystalline glass, automotive glass, ITO glass, ultra white glass | 700℃/7~10min | ≤ 3mΩ/sq/mil | Conductive circuits such as microcrystalline glass, automotive glass, ITO glass, and ultra white glass |
| CP5801 | Microcrystalline glass, automotive glass, ITO glass, ultra white glass | 620℃/7~10min | < 3mΩ/sq/mil | Conductive circuits such as microcrystalline glass, automotive glass, ITO glass, and ultra white glass |
| CP5802 | Alumina ceramic | 830℃/7~10min | < 2mΩ/sq/mil | Thermal printing chips, ceramic sensors, atomizer chips, transducer chips, buzzer chips, etc |
| CP5803 | Alumina ceramic | 830℃/7~10min | < 2mΩ/sq/mil | Thermal printing chips, ceramic sensors, atomizer chips, transducer chips, buzzer chips, etc |
| CP8065 | Alumina ceramic | 810℃/7~10min | ≤ 3mΩ/sq/mil | Thermal printing chips, ceramic sensors, atomizer chips, transducer chips, buzzer chips, etc |
| CP8070 | Alumina ceramic | 810℃/7~10min | ≤ 3mΩ/sq/mil | Thermal printing chips, ceramic sensors, atomizer chips, transducer chips, buzzer chips, etc |
| CP05WA2 | Alumina ceramic | 830~850℃/10min | < 2mΩ/sq/mil | Circuit protection devices, high-power LED substrates |
| CP850x | Alumina ceramic | 850℃/10~12min | ≤ 2.4~5mΩ/sq | Ceramic thick film circuits, GPS dielectric rod antennas, thick film heaters, chip component, ozonator |
| CP4306 | SUS430 with printed dielectric paste, ceramics | 850℃/10min | ≤ 2.2mΩ/sq | Chip resistor, thick film hybrid integrated circuit, ceramic capacitor, filter and home appliance |
| CP093D | Stainless steel with printed dielectric paste | 850℃/10min | Specially designed for thick film circuits on stainless steel substrates | |
| CP094 | Alumina ceramic | 850℃/10min | Front conductor of chip resistor, can be electroplated or chemically plated, with excellent acid resistance | |
| CP095 | Alumina ceramic | 850℃/10min | Back conductor of chip resistor, can be electroplated or chemically plated, with excellent acid resistance | |
| CP8050 | Alumina ceramic | 750~850℃/10min | Excellent adhesion and excellent welding resistance, suitable for GPS piezoelectric ceramics | |
| CP8060 | Alumina ceramic | 750~850℃/10min | Excellent adhesion and excellent welding resistance, suitable for GPS piezoelectric ceramics | |
| CP8065 | Alumina ceramic | 750~850℃/10min | Excellent adhesion and excellent welding resistance, suitable for GPS piezoelectric ceramics | |
| CP8070 | Alumina ceramic | 750~850℃/10min | Excellent adhesion and excellent welding resistance, suitable for GPS piezoelectric ceramics | |
| CP805F | Alumina ceramic | 750~850℃/10min | Applied to atomized sheets, honeycomb sheets, and transducer piezoelectric ceramics, it has excellent printing performance, stackability, and non stick properties | |
| CP807F | Alumina ceramic | 750~850℃/10min | Applied to atomized sheets, honeycomb sheets, and transducer piezoelectric ceramics, it has excellent printing performance, stackability, and non stick properties | |
| CP115N | Aluminum Nitride (AlN) | 850℃/>10min | Strong adhesion, multiple sintering without foaming, excellent welding resistance and electroplating corrosion resistance |
| Substrate | Curing Condition | Conductivity | Main Application | |
|---|---|---|---|---|
| CP08xx-H | Alumina Ceramics | 850℃/10~12min | ≤3~30mΩ/sq | Thick film circuits, automobile sensors, auto electrics, communication interface circuits |
| CP08xx-A | Alumina Ceramics | 850℃~1530℃ | Chip capacitors, chip inductors, multilayer piezoelectric, pressure-sensitive and other electronic components | |
| CP08xx-N | Aluminum Nitride(AIN) | 850℃/＞10min | ≤3~30mΩ/sq | High-performance thick film integrated circuits, Automotive electronics |
Graphite Carbon Paste
| Substrate | Curing Condition | Conductivity | Main Application | |
|---|---|---|---|---|
| CP2001 | PET/PI | 110℃/20min | < 20Ω/sq/mil | Membrane switches, flexible printed circuits |
| CP2002 | PET/PI | 120℃/30min | < 8Ω/sq/mil | Membrane switches, flexible printed circuits, zebra connectors |