Palladium Silver Paste for Alumina Ceramics CP08xx-H
Our Pd-Ag paste CP08XX-H series is an environmentally palladium silver conductive paste. It is designed for special circuits inner connecting and terminal electrode of high-performance thick film integrated circuits, automotive electronics, etc.
Benefits of the Pd-Ag paste include:
- Strong adhesion
- Good solder ability
- Effectively Restrain from Ag ion Moving
Typical Application
- High-performance thick film integrated circuits
- Automotive electronics
Technical Parameters
| Test | Properties |
|---|---|
| Solid Content (%) | 81~85 |
| Palladium Content (%) | 1 |
| Viscosity (Pa.S)(Brookfield DV1, 10rpm, 25±0.5℃) | 180~250 |
| Fineness(μm) | ≤10 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 200~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃ / 200(mm/min) / 8-12min |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 11-15 |
| Spreading Rate(cm2/g) (fired thickness:14μm) | ~100 |
| Conductivity (mΩ/sq) | ≤ 3 |
| Solder ability | Excellent |
| Solder resistance(times)(260℃, 10s) | ≥2 |
| Adhesion(N/2×2mm2) | ≥30N |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Solid Content (%) | 81~85 |
| Palladium Content (%) | 3 |
| Viscosity (Pa.S)(Brookfield DV1, 10rpm, 25±0.5℃) | 180~250 |
| Fineness(μm) | ≤10 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 200~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃ / 200(mm/min) / 8-12min |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 11-15 |
| Spreading Rate(cm2/g) (fired thickness:14μm) | ~100 |
| Conductivity (mΩ/sq) | ≤ 4 |
| Solder ability | Excellent |
| Solder resistance(times)(260℃, 10s) | ≥2 |
| Adhesion(N/2×2mm2) | ≥30N |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Solid Content (%) | 81~85 |
| Palladium Content (%) | 5 |
| Viscosity (Pa.S)(Brookfield DV1, 10rpm, 25±0.5℃) | 250~350 |
| Fineness(μm) | ≤10 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 200~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃ / 200(mm/min) / 8-12min |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 11-15 |
| Spreading Rate(cm2/g) (fired thickness:14μm) | ~100 |
| Conductivity (mΩ/sq) | ≤ 6 |
| Solder ability | Excellent |
| Solder resistance(times)(260℃, 10s) | ≥3 |
| Adhesion(N/2×2mm2) | ≥30N |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Solid Content (%) | 81~85 |
| Palladium Content (%) | 10 |
| Viscosity (Pa.S)(Brookfield DV1, 10rpm, 25±0.5℃) | 320~420 |
| Fineness(μm) | ≤10 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 200~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃ / 200(mm/min) / 8-12min |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 11-15 |
| Spreading Rate(cm2/g) (fired thickness:14μm) | ~100 |
| Conductivity (mΩ/sq) | ≤ 10 |
| Solder ability | Excellent |
| Solder resistance(times)(260℃, 10s) | ≥4 |
| Adhesion(N/2×2mm2) | ≥30N |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Solid Content (%) | 81~85 |
| Palladium Content (%) | 15 |
| Viscosity (Pa.S)(Brookfield DV1, 10rpm, 25±0.5℃) | 320~420 |
| Fineness(μm) | ≤10 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 200~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃ / 200(mm/min) / 8-12min |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 11-15 |
| Spreading Rate(cm2/g) (fired thickness:14μm) | ~100 |
| Conductivity (mΩ/sq) | ≤ 20 |
| Solder ability | Excellent |
| Solder resistance(times)(260℃, 10s) | ≥4 |
| Adhesion(N/2×2mm2) | ≥20N |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Solid Content (%) | 81~85 |
| Palladium Content (%) | 20 |
| Viscosity (Pa.S)(Brookfield DV1, 10rpm, 25±0.5℃) | 320~420 |
| Fineness(μm) | ≤10 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 200~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃ / 200(mm/min) / 8-12min |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 11-15 |
| Spreading Rate(cm2/g) (fired thickness:14μm) | ~100 |
| Conductivity (mΩ/sq) | ≤ 30 |
| Solder ability | Excellent |
| Solder resistance(times)(260℃, 10s) | ≥5 |
| Adhesion(N/2×2mm2) | ≥20N |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Solid Content (%) | 81~85 |
| Palladium Content (%) | 30 |
| Viscosity (Pa.S)(Brookfield DV1, 10rpm, 25±0.5℃) | 320~420 |
| Fineness(μm) | ≤10 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 200~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃ / 200(mm/min) / 8-12min |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 11-15 |
| Spreading Rate(cm2/g) (fired thickness:14μm) | ~100 |
| Conductivity (mΩ/sq) | ≤ 50 |
| Solder ability | Excellent |
| Solder resistance(times)(260℃, 10s) | ≥5 |
| Adhesion(N/2×2mm2) | ≥20N |
| Shelf Life | Six Months from Date of Shipment |