High Temperature Sintering Silver Paste CP850x
Our silver paste CP850X series is a high-temperature sintered conductive paste. It is non-toxic element up to European RoHS environmental regulation. It is designed on various ceramic thick film circuits, GPS dielectric rod antennas, Thick film heaters, chip component, ozonator, etc.
Benefits of the silver paste include:
- Strong adhesion
- Good solder ability
- Excellent ageing resistance
- Good conductivity
Typical Application
- Ceramic Thick Film Circuits
- GPS Dielectric Rod Antennas
- Thick Film Heaters
- Chip Component
- Ozonator
Technical Parameters
Description
CP850A is an environmentally conductor paste designed for thick film circuit on stainless steel substrate. It is non-toxic element and up to European RoHS environmental regulation. And it has features of strong adhesion, good weldability, excellent aging resistance, low resistance and good printing performance.
Substrates
430 type stainless steel substrate printed with DP850A, ceramic substrate
| Test | Properties |
|---|---|
| Solid Content (%) | 86±2 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 200±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 250~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃/＞10min |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 14-20 |
| Conductivity (mΩ/sq) | ≤ 2.2(Fired thickness:20μm) |
| Adhesion(Vertical pull up,2mm*2mm,Sn/Ag3.0/Cu0.5, 300+5℃) | ≥30N |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Ag Content (%) | 80 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 200±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 250~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃/200(mm/min) |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 12-16 |
| Conductivity (mΩ/sq) | ≤ 2.4 |
| Solderability(235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) | The tin Area ≥95% |
| Soldering Resistance (times)(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) | ≥1 |
| Adhesion((N/2×2mm2) | ≥30 |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Ag Content (%) | 75 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 150±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 250~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃/200(mm/min) |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 12-16 |
| Conductivity (mΩ/sq) | ≤ 3 |
| Solderability(235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) | The tin Area ≥95% |
| Soldering Resistance (times)(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) | ≥1 |
| Adhesion((N/2×2mm2) | ≥30 |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Ag Content (%) | 70 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 150±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 250~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃/200(mm/min) |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 6-10 |
| Conductivity (mΩ/sq) | ≤ 4 |
| Solderability(235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) | The tin Area ≥95% |
| Soldering Resistance (times)(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) | ≥1 |
| Adhesion((N/2×2mm2) | ≥30 |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Ag Content (%) | 65 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 150±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 250~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃/200(mm/min) |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 6-10 |
| Conductivity (mΩ/sq) | ≤ 4 |
| Solderability(235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) | The tin Area ≥95% |
| Soldering Resistance (times)(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) | ≥1 |
| Adhesion((N/2×2mm2) | ≥30 |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Ag Content (%) | 60 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 150±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 250~325 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃-150℃-150℃-120℃/200(mm/min) |
| Recommended Firing Conditions | 850℃/10-12min |
| Fired Thickness (μm) | 6-10 |
| Conductivity (mΩ/sq) | ≤ 5 |
| Solderability(235±5℃, 10s/time; Sn96.5Ag3Cu0.5 solder) | The tin Area ≥95% |
| Soldering Resistance (times)(260±5℃, 10s/time, Sn96.5Ag3Cu0.5 solder) | ≥1 |
| Adhesion((N/2×2mm2) | ≥30 |
| Shelf Life | Six Months from Date of Shipment |