High-Temp Sintering Paste
Formulated for firing above 800°C on alumina, aluminum nitride, or other durable ceramics. These materials deliver maximum chemical resistance, mechanical toughness, and bonding strength for harsh‑environment applications such as automotive sensors, solid‑oxide fuel cells, and high‑power electronics.

| Description | Substrate | Firing Condition | Conductivity | Features & Application | |
|---|---|---|---|---|---|
| CP5802 | Silver Paste | Alumina ceramic | 830℃/7~10min | <2mΩ/sq/mil | Applied to thermal printing chips, ceramic sensors, atomizer chips, transducer chips, buzzer chips, etc |
| CP5803 | Silver Paste | Alumina ceramic | 830℃/7~10min | <2mΩ/sq/mil | Applied to thermal printing chips, ceramic sensors, atomizer chips, transducer chips, buzzer chips, etc |
| CP8065 | Silver Paste | Alumina ceramic | 810℃/7~10min | ≤3mΩ/sq/mil | Applied to thermal printing chips, ceramic sensors, atomizer chips, transducer chips, buzzer chips, etc |
| CP8070 | Silver Paste | Alumina ceramic | 810℃/7~10min | ≤3mΩ/sq/mil | Applied to thermal printing chips, ceramic sensors, atomizer chips, transducer chips, buzzer chips, etc |
| CP05WA2 | Silver Paste | Alumina ceramic | 830~850℃/10min | <2mΩ/sq/mil | Applied to circuit protection devices, high-power LED substrates |
| CP850x | Silver Paste | Alumina ceramic | 850℃/10~12min | ≤2.4~5mΩ/sq | Applied to ceramic thick film circuits, GPS dielectric rod antennas, thick film heaters, chip component, ozonator |
| CP4306 | Silver Paste | SUS430 with printed dielectric paste, ceramics | 850℃/10min | ≤ 2.2mΩ/sq | Applied to chip resistor, thick film hybrid integrated circuit, ceramic capacitor, filter and household appliance |
| CP093D | Silver Paste | Stainless steel with printed dielectric paste | 850℃/10min | Specially designed for thick film circuits on stainless steel substrates | |
| CP094 | Silver Paste | Alumina ceramic | 850℃/10min | Applied to front conductor of chip resistor, can be electroplated or chemically plated, with excellent acid resistance | |
| CP095 | Silver Paste | Alumina ceramic | 850℃/10min | Applied to back conductor of chip resistor, can be electroplated or chemically plated, with excellent acid resistance | |
| CP8050 | Silver Paste | Alumina ceramic | 750~850℃/10min | Excellent adhesion and excellent welding resistance, suitable for GPS piezoelectric ceramics | |
| CP8060 | Silver Paste | Alumina ceramic | 750~850℃/10min | Excellent adhesion and excellent welding resistance, suitable for GPS piezoelectric ceramics | |
| CP8065 | Silver Paste | Alumina ceramic | 750~850℃/10min | Excellent adhesion and excellent welding resistance, suitable for GPS piezoelectric ceramics | |
| CP8070 | Silver Paste | Alumina ceramic | 750~850℃/10min | Excellent adhesion and excellent welding resistance, suitable for GPS piezoelectric ceramics | |
| CP805F | Silver Paste | Alumina ceramic | 750~850℃/10min | Applied to atomized sheets, honeycomb sheets, and transducer piezoelectric ceramics, it has excellent printing performance, stackability, and non stick properties | |
| CP807F | Silver Paste | Alumina ceramic | 750~850℃/10min | Applied to atomized sheets, honeycomb sheets, and transducer piezoelectric ceramics, it has excellent printing performance, stackability, and non stick properties | |
| CP115-N | Silver Paste | AlN substrate | 850℃/>10min | AlN substrate, with strong adhesion, multiple firing without foaming, excellent soldering resistance and electroplating corrosion resistance | |
| CP08xx-N | Pd/Ag Paste | AlN substrate | 850℃/>10min | ≤ 3~30mΩ/sq | Applied to high-performance thick film integrated circuits, automotive electronics |
| CP08xx-H | Pd/Ag Paste | Alumina ceramic | 850℃/10~12min | ≤ 3~30mΩ/sq | Applied to high-performance thick film integrated circuits, automotive electronics |
| CP08xx-A | Pd/Ag Paste | Alumina ceramic | 850~1530℃ | Applied to chip capacitors, chip inductors, multilayer piezoelectric, pressure-sensitive and other electronic components |
Resistor Paste (Sintered above 800℃)
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| Description | Substrate | Firing Condition | Sheet Resistance | TCR(ppm/℃) | Main Application | |
|---|---|---|---|---|---|---|
| RP0115 | Pd/Ag Resistor Paste | SUS430 stainless steel, alumina ceramic | 850℃/10min | 10mΩ/sq ±10% | 1500±10% | Applied to thick film circuits |
| RP0315 | Pd/Ag Resistor Paste | SUS430 stainless steel, alumina ceramic | 850℃/10min | 30mΩ/sq ±10% | 1500±10% | Applied to thick film circuits |
| RP0515 | Pd/Ag Resistor Paste | SUS430 stainless steel, alumina ceramic | 850℃/10min | 50mΩ/sq ±10% | 1500±10% | Applied to thick film circuits |
| RP1015 | Pd/Ag Resistor Paste | SUS430 stainless steel, alumina ceramic | 850℃/10min | 100mΩ/sq ±10% | 1500±10% | Applied to thick film circuits |
| RP2015 | Pd/Ag Resistor Paste | SUS430 stainless steel, alumina ceramic | 850℃/10min | 200mΩ/sq ±10% | 1500±10% | Applied to thick film circuits |
| RP1006 | Pd/Ag Resistor Paste | SUS430 stainless steel, alumina ceramic | 850℃/10min | 100mΩ/sq ±10% | 600±10% | Applied to thick film circuits |
| RP2006 | Pd/Ag Resistor Paste | SUS430 stainless steel, alumina ceramic | 850℃/10min | 200mΩ/sq ±10% | 600±10% | Applied to thick film circuits |
| RPS8 | Ru Resistor Paste | Stainless steel with printed dielectric paste | 850℃/10min | 8Ω/sq ±10% | <+600 | High power load stability, customizable temperature coefficient, and good process stability |
| RPS10 | Ru Resistor Paste | Stainless steel with printed dielectric paste | 850℃/10min | 10Ω/sq ±10% | <+600 | High power load stability, customizable temperature coefficient, and good process stability |
| RPS50 | Ru Resistor Paste | Stainless steel with printed dielectric paste | 850℃/10min | 50Ω/sq ±10% | <+400 | High power load stability, customizable temperature coefficient, and good process stability |
| RPS100 | Ru Resistor Paste | Stainless steel with printed dielectric paste | 850℃/10min | 100Ω/sq ±10% | <+400 | High power load stability, customizable temperature coefficient, and good process stability |
| RPS150 | Ru Resistor Paste | Stainless steel with printed dielectric paste | 850℃/10min | 150Ω/sq ±10% | <+400 | High power load stability, customizable temperature coefficient, and good process stability |
| RPS200 | Ru Resistor Paste | Stainless steel with printed dielectric paste | 850℃/10min | 200Ω/sq ±10% | <+400 | High power load stability, customizable temperature coefficient, and good process stability |
| RPL10 | Pd/Ag/Ru Resistor Paste | Alumina ceramic | 850℃/10min | 1Ω/sq ±20% | 0-+400 | Good power load stability, low temperature coefficient, and good process stability |
| RPL50 | Pd/Ag/Ru Resistor Paste | Alumina ceramic | 850℃/10min | 5Ω/sq ±20% | 0-+300 | Good power load stability, low temperature coefficient, and good process stability |
| RPL11 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 10Ω/sq ±20% | 0-+200 | Good power load stability, low temperature coefficient, and good process stability |
| RPL21 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 20Ω/sq ±20% | ±150 | Good power load stability, low temperature coefficient, and good process stability |
| RPL51 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 50Ω/sq ±20% | ±150 | Good power load stability, low temperature coefficient, and good process stability |
| RPL12 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 100Ω/sq ±20% | ±150 | Good power load stability, low temperature coefficient, and good process stability |
| RPL52 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 500Ω/sq ±20% | ±150 | Good power load stability, low temperature coefficient, and good process stability |
| RPL13 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 1KΩ/sq ±20% | ±150 | Good power load stability, low temperature coefficient, and good process stability |
| RPH13 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 1KΩ/sq ±20% | ±150 | Applied to high-voltage gathering potentiometers, high-voltage resistors, rod-shaped resistors, etc |
| RPH14 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 10KΩ/sq ±20% | ±150 | Applied to high-voltage gathering potentiometers, high-voltage resistors, rod-shaped resistors, etc |
| RPH15 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 100KΩ/sq ±20% | ±150 | Applied to high-voltage gathering potentiometers, high-voltage resistors, rod-shaped resistors, etc |
| RPH16 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 1MΩ/sq ±20% | ±150 | Applied to high-voltage gathering potentiometers, high-voltage resistors, rod-shaped resistors, etc |
| RPH26 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 2MΩ/sq ±20% | ±150 | Applied to high-voltage gathering potentiometers, high-voltage resistors, rod-shaped resistors, etc |
| RPH17 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 10MΩ/sq ±20% | ±150 | Applied to high-voltage gathering potentiometers, high-voltage resistors, rod-shaped resistors, etc |
| RPH27 | Ru Resistor Paste | Alumina ceramic | 850℃/10min | 20MΩ/sq ±20% | ±150 | Applied to high-voltage gathering potentiometers, high-voltage resistors, rod-shaped resistors, etc |
| RPE-03xx | Ag/Pd/Pt Resistor Paste | Alumina ceramic | 850℃/10min | 10mΩ~1Ω/sq | <300 | With stable resistance and extremely low attenuation |
| RPE-06xx | Ag/Pd/Pt Resistor Paste | Alumina ceramic | 850℃/10min | 10mΩ~1Ω/sq | <600 | With stable resistance and extremely low attenuation |
| RPE-15xx | Ag/Pd/Pt Resistor Paste | Alumina ceramic | 850℃/10min | 10mΩ~1Ω/sq | <1500 | With stable resistance and extremely low attenuation |
| RPN-50xx | Ru Resistor Paste | AlN substrate | 850℃/10min | 10Ω~1kΩ/sq | ±150 | for AlN substrates, with low current noise, high withstand voltage characteristics, low power attenuation, and stable resistance value |
| RPG05 | Pd/Ag Resistor Paste | Glass-ceramic | 850~900℃/10min | 20~100mΩ/sq | 600~2000 | Specially developed for glass-ceramic thick film heaters, it has stable resistance value after sintering, resistance to temperature shock, and excellent matching with the substrate |
Dielectric Paste (Fired above 800℃)
| Substrate | Firing Condition | Features & Main Application | |
|---|---|---|---|
| DP4301 | 400-series (including 430/444, etc.) ferritic stainless steel substrates | 850℃/5~10min | Excellent insulating property, applied to thick film heating element |
| DP4302 | 400-series (including 430/444/404, etc.) ferritic stainless steel substrates | 850℃/5~10min | Breakdown voltage >2000 V/3s (fired film thickness >80μm, 25℃) |
| DP3041 | 300-series (including 304/316, etc.) austenitic stainless steel substrates | 850℃/5~10min | Breakdown voltage >2000 V/3s (fired film thickness >80μm, 25℃) |
| DP021 | Polycrystalline titanium/monocrystalline titanium plate | 850℃/5~10min | Breakdown voltage >2000 V/3s (fired film thickness >80μm, 25℃) |
Overcoat Protective Paste (Fired above 800℃)
| Substrate | Firing Condition | Features & Main Application | |
|---|---|---|---|
| OP8501 | Stainless Steel with printed dielectric/conductor/resistor paste | 850℃/10min | Applied to hybrid circuit, resistor plate, heating element, and sensitivity element |
| OP8504 | Stainless Steel with printed dielectric/conductor/resistor paste | 850℃/10min | Applied to hybrid circuit, resistor plate, heating element, and sensitivity element |
| OP4302 | 400-series stainless steel substrates with printed dielectric/conductor/resistor paste | 850℃/5~10min | Excellent insulation strength |
| OP3041 | 300-series stainless steel substrates with printed dielectric/conductor/resistor paste | 850℃/5~10min | Excellent insulation strength |