Electronic pastes for aluminum nitride (AlN) and alumina (Al₂O₃) series are tailored to meet different thermal and electrical requirements in applications such as print bars, chip resistors and AlN-based RF resistors. Alumina pastes are cost-effective, provide good insulation and mechanical strength, and are widely used in thick-film circuits on print bars. In contrast, AlN pastes—typically including conductor, resistor, and dielectric pastes—are designed for high-power RF resistors where excellent thermal conductivity and close thermal expansion matching to AlN substrates are critical, enabling efficient heat dissipation and stable high-frequency performance.