Medium Temperature Sintering Silver Paste CP550x
Our silver paste CP550x series is a medium temperature sintering conductor paste. It is non-toxic element up to European RoHS environmental regulation. It is designed on alumina ceramic, quartz glass substrate, chip component, consumed hybrid integrated thick film circuit, heating element and household appliances.
Benefits of the silver paste include:
- Strong adhesion
- Good solder ability
- Excellent ageing resistance
- Good conductivity
Typical Application
- Chip component
- Consumed Hybrid Integrated Thick Film Circuit
- Heating Element
- Household Appliances
Technical Parameters
| Test | Properties |
|---|---|
| Ag Content (%) | 80 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 200±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 280 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃/10min |
| Recommended Firing Conditions | 550-650℃/＞10min |
| Film Thickness (μm) | 12-16 |
| Conductivity (mΩ/sq) | ≤ 3 |
| Solderability | Excellent |
| Soldering Resistance (times) (235℃, 10s, PbSn Solder) | ≥2 |
| Adhesion((N/2×2mm2) | ≥20 |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Ag Content (%) | 75 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 200±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 280 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃/10min |
| Recommended Firing Conditions | 550-650℃/＞10min |
| Film Thickness (μm) | 12-16 |
| Conductivity (mΩ/sq) | ≤ 3 |
| Solderability | Excellent |
| Soldering Resistance (times) (235℃, 10s, PbSn Solder) | ≥2 |
| Adhesion((N/2×2mm2) | ≥20 |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Ag Content (%) | 70 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 200±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 280 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃/10min |
| Recommended Firing Conditions | 550-650℃/＞10min |
| Film Thickness (μm) | 12-16 |
| Conductivity (mΩ/sq) | ≤ 4 |
| Solderability | Good |
| Soldering Resistance (times) (235℃, 10s, PbSn Solder) | ≥2 |
| Adhesion((N/2×2mm2) | ≥20 |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Ag Content (%) | 65 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 200±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 280 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃/10min |
| Recommended Firing Conditions | 550-650℃/＞10min |
| Film Thickness (μm) | 12-16 |
| Conductivity (mΩ/sq) | ≤ 4 |
| Solderability | Good |
| Soldering Resistance (times) (235℃, 10s, PbSn Solder) | ≥2 |
| Adhesion((N/2×2mm2) | ≥20 |
| Shelf Life | Six Months from Date of Shipment |
| Test | Properties |
|---|---|
| Ag Content (%) | 60 |
| Viscosity (Pa.S)(NDJ-99, 4#, 10rpm, 25±0.5℃) | 200±50 |
| Fineness(μm) | ＜12 |
| Screen Mesh(Stainless steel/ Polyester Mesh) | 280 |
| Leveling Time | At room temperature, 2-3 min |
| Recommended Drying Conditions | 150℃/10min |
| Recommended Firing Conditions | 550-650℃/＞10min |
| Film Thickness (μm) | 12-16 |
| Conductivity (mΩ/sq) | ≤ 5 |
| Solderability | Good |
| Soldering Resistance (times) (235℃, 10s, PbSn Solder) | ≥2 |
| Adhesion((N/2×2mm2) | ≥20 |
| Shelf Life | Six Months from Date of Shipment |